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Kitting Clerk

  • Job Type: Full Time
  • Posted date: Aug 18, 2019
  • Country: United States
  • State: New York
  • City: Bohemia

Micro-assembly Kitting Clerk

Looking for a F/T micro-assembly kitting and receiving person for a growing fast-paced micro-electronics company. Must have strong communication, organizational skills and be able to multi-task. Must be able to work with micro-components (transistors, chip capacitors, etc.) using microscope and pick/kit parts for assembly using tweezers.  Ability to pick and place microscopic parts with dexterity is a must. Must be able to read a BOM/pick list. Entry level welcome if able to pass dexterity test. Experience 1 to 3 years preferred. Must be able to use Microsoft Office. 


Qualifications:

High School Diploma or Equivalent


Benefits:

Full time position with 401K plan, medical benefits, Life insurance available. Salary commensurate with experience and ability. 


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Micro-Assembler A

  • Job Type: Full Time
  • Posted date: Aug 18, 2019
  • Country: United States
  • State: New York
  • City: Bohemia

JOB SUMMARY/ESSENTIAL DUTIES:

  1. Strong grasp of ESD issues and precautions to prevent damage to anything in your workplace or others’.
  2. Ability to safely install SMA or similar connectors to housings for testing purposes.
  3. A sure and steady hand while working under a microscope with basic hand tools such as torque wrenches/drivers, screwdrivers and fine tweezers.
  4. Experience with wire and ribbon bonding to micro-sized coils, capacitors, resistors, diodes, transistors (GaAs FETs) as well as MMICs.
  5. Proficiency in several types of bonding techniques, including Wedge Bonding, Die Bonding and Ball Bonding. Familiarity with Westbond bonding equipment is a big PLUS.
  6. Ability to perform fabrication of hybrid microcircuits such as gold wire bonding onto small pad sizes which requires special setup and bonding techniques as alluded to earlier.
  7. Familiarity with various types of epoxy, such as common long-term and short-term epoxy for curing as well as sealing.
  8. At least the most basic understanding of the creation of hybrid, substrate-based RF / Microwave amplifier circuits using the chip and wire techniques outlined above.
  9. Experience with kitting components mentioned above (picking and placing from inventory into various carriers and/or trays for different projects), especially FETs and MMICs, is a PLUS.


BASIC QUALIFICATIONS


  1. High School Diploma
  2. Generally good hand and finger dexterity
  3. Minimum 4 years of experience as a “B” assembler or 2 years as an “A” assembler
  4. At least 1 year gathering experience in performing assembly from a print and BOM
  5. Ability to work individually by coordinating your efforts with others OR as a team in which you simply do your part in helping your workmates achieve a common goal.


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Senior RF/Microwave Design Engineer

  • Job Type: Full Time
  • Posted date: Aug 18, 2019
  • Country: United States
  • State: New York
  • City: Bohemia

JOB SUMMARY:


The Engineer will be responsible for product development activities for the RF/MW business, which will require familiarity with discrete hybrid RF amplifier circuits, MMICs and GaN devices.  The candidate will also play a part in developing engineering goals and initiatives essential to promoting technological trends and supporting the continuing growth of the company.


ESSENTIAL DUTIES:

  • Hands-on design of existing and self-designed RF/Microwave amplifiers and amplifier assemblies.
  • Provision of technical direction and guidance, as well as hands-on project management, for product development.
  • Maximization of the optimal application of technology and engineering resources to meet product development and/or customer requirements.
  • Implementation of formal processes to support the company’s product development initiatives.
  • Regular interaction with other employees/managers to establish divisional strategic plans and objectives.
  • Ability to adapt and learn quickly, to work independently and responsibly with little supervision.

QUALIFICATIONS:

  • Bachelor's Degree with minimum of 5 years experience and Master's Degree with minimum 2 years experience.
  • Minimum of 5 years experience in the RF/Microwave industry, including design, assembly and testing of hybrid chip and wire technology.
  • Prior project management experience overseeing design, development, completion of various special projects and programs.
  • Knowledge of and experience with RF/MW Semiconductor circuit techniques using GaAs, GaN and MMIC technology.
  • Working knowledge of MS Office product suite, including MS Project or equivalent
  • At least basic familiarity with 3D modeling/CAD software systems.
  • Familiarity with Microwave simulation tools like AWR Microwave Office, ADS is a PLUS.
  • Motivation of self and colleagues to accomplish overall company goals as well as individual projects.
  • Must also have good verbal/written communication, interpersonal, and organizational skills.
  • Candidate must be a U.S. citizen.

BENEFITS:


  • Medical
  • 401K, etc.


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