Description: We are looking for a microwave components hybrid assembler with wire bonding and component attachment experience. The ideal candidate should be experienced with westbond 7400b series wedge bonding with 0.0007 gold wire die wire bonding, as well as 0 .001 mil gold ball wire bonding. They must also have experience with epoxy attachment for die, substrate, and passive component attachment . This job requires the layout of ESD components into complex circuits under a microscope by hand - accuracy is absolutely essential. Interested applicants should send their resume to info@amplitechinc.com. Please provide detailed explanations of the equipment worked with and the types of products you have worked on.